- Audio/Video Processing
- Battery Charging
- Circuit Protection
- Data Conversion
- Data Storage
- Display Systems
- Embedded Processing
- Energy Harvesting
- Energy Storage
- Eval/Dev Tool
- General Purpose
- Human Interface
- Industrial Automation
- Industrial Control
- IoT Internet of Things
- Motor Control
- Optical Communication
- Power Management
- RF/EMI Shielding
- Signal Processing
- Single Board Computer
- Thermal Management
- Timing & Clock Management
- Wired Communication
- Wireless Communication
VISATON broadband speakers use different materials for speaker components, meeting requirements for a variety of applications.
KEMET's JSN series is a jumbo stacked, naked metalized polyester film capacitor with flat terminations, which meets AEC-Q200 qualification requirements.
Texas Instruments' AFE7799 quad-channel RF transceiver offers feedback paths and is ideal for applications such as telecom and microwave backhaul.
Microsemi's PD69101ILQ is a single-port, mixed-signal, high-voltage PoE driver that enables network devices to share power and data over the same cable.
Texas Instruments' TMUX1511 4-channel, powered-off protection CMOS switches possess features that can reduce system complexity and overall system cost.
ROHM’s silicon carbide (SiC) MOSFETs come in a variety of ON resistances and voltage (VDSS) ratings of 650 V, 1,200 V, or 1,700 V.
Alliance Memory’s AEC-Q100 compliant CMOS SDRAMs are available in a wide range of densities and package options.
Alliance Memory offers a complete low-power SDRAM portfolio in a wide range of densities and package options.
ASSMANN WSW Components’ pogo pins provides highly durable and reliable connections with up to 1 million mating cycles.
NXP offers smart charging options for your devices with higher power density & security, ability to provide total USB Type-C AC-DC, end-2-end charging solutions.
Molex’s FSB5 series 0.40 mm pitch floating SlimStack™ board-to-board connectors are ideal for automotive, industrial, and consumer industry applications.
Renesas’ RX23T is designed for complex inverter control algorithms for induction heat (IH) control and inverter heaters.
Renesas’ RX130 MCUs with integrated capacitive touch capabilities enable smaller board designs and reduce cost.
Renesas’ Synergy high-performance Arm® Cortex® MCU S5D9 with built-in TFT-LCDC supports cloud connectivity as well as LCD control.