TG-NSP80 Non-Silicone Putty

T-Global's non-silicone formulation TG-NSP80, is an ultra-high performance, silicone-free, thermally conductive putty. It is very stable and has a long shelf life of five years. With a thermal conductivity of 8.3 W/mK and the ability to form thin bond lines, this putty is the perfect choice for the most demanding applications.

Due to its highly conforming nature, it is an ideal solution for assemblies with multiple thermal interfaces, varying tolerances, and high-volume mass production dispensing scenarios. Suitable for gaps between 0.2 mm to 5.0 mm, this one product can be used for many applications, thus simplifying the bill of materials and consolidating supplier bases.

Because TG-NSP80 is a totally silicone-free formula, it is perfect for silicone sensitive scenarios such as assemblies with optics, optical HDDs, automotive applications, and military equipment. TG-NSP80 is available supplied in pots or syringes.