Wakefield Vette Minute: 900 Series Chipset Heat Sink Attachment
Wakefield-Vette’s 900 Series Heat Sinks for BGA Chipsets can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.
Publish Date: 2016-04-12
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Heat Pipe Overview: Wakefield-Vette
Fluid Phase Change applications, often referred to as “re-circulating,” use closed loop heat pipes to transfer heat quickly through evaporation and condensation within the heat pipe.
Publish Date: 2016-04-12
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Wakefield Solutions Aluminum Extrusion Press
Since its days as National Northeast, Wakefield Solutions has been one of the leading aluminum extruders and secondary machining since 1953! With two extrusions presses and over 110 Machining Centers!
Publish Date: 2016-04-12
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Bonded Fin Heat Sinks: Wakefield-Vette
Bonded fins are a good high power solution for either natural or forced convection. Individual straight fins are cut and bonded into a grooved base plate.
Publish Date: 2016-04-12
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