New Product

T-Global silicone-based low bleed series thermal pads incorporate high performance and maintained stability alongside advanced oil bleed technology.

New Product

The T-Global Technology TG-ASD35AB fast-curing silicone-based thermal gel provides a high-elasticity formulation to ensure a secure fit.

New Product

The T-Global OB vapor chamber is an efficient, ultra-thin passive heat spreading solution for high-performance electronics.

Ultra-soft thermal pads improve server cooling efficiency by enhancing heat transfer, reducing thermal resistance, and protecting sensitive components.

T-Global TG-AD series thermal pads are formulated to provide the ideal combination of low hardness and high thermal conductivity with good electrical isolation.

T-Global’s TG-N4000 non-silicone thermal putty is a high-performance thermally conductive gap filler designed for use in silicone-sensitive applications.

T-Global's TG-N8000 non-silicone putty is a high-performance thermally conductive gap filler.

T-Global Technology’s TG-A7000 silicone putty is a thermally conductive gap filler designed for demanding applications and long term reliable performance.

T-Global Technology’s TG-A9000 series silicone pads are ultra-soft and are available as sheets or as die-cut parts.

T-Global's TG-A6200LC series silicone thermal pads provide excellent heat transfer characteristics with improved handling and a non-tacky face.

T-Global's TG-ALC series provides effective heat transfer when space is limited and low thermal impedance is paramount.

T-Global’s TG-T1000T provides superior holding strength and initial tack when compared to other thermal tapes.

T-Global's TG-A1250LC series provides a thermal pad with heat transfer characteristics that improve handling and a non-tacky face to aid assembly and rework.

T-Global’s GT10D silicone thermal pad provides a thin but effective heat transfer when space is limited and reliable electrical isolation between components.

T-Global's A20K and A38K silicone thermal pads are robust, easy to handle, and have high breakdown voltages and temperature limits for demanding applications.

T-Global's non-silicone formulation TG-NSP80 is an ultra-high performance, silicone-free, thermally conductive putty.

Removing adhesive properly from a heatsink for reuse

t-Global’s TG-A series pads allow surface imperfections at the interface to be filled, reducing thermal impedance and enabling maximum heat transfer.

T-Global's PC98 series has stable pot life and long shelf life even at room temperature of 25°C.