Tflex™ B200 Thermal Gap Filler

Laird Thermal Materials' Tflex B200 is a reliable, compliant thermal interface material offering good thermal performance and easy handling. It is designed for improved EV battery pack cooling; however, with the multiple surface and reinforcement options available, it is ideal for a variety of applications. It helps absorb shock, which improves device reliability over the long term. It has high dielectric insulation protecting against dielectric breakdown in or between devices. Tflex B200's low modulus interface and softness relieves mechanical stress and fills gaps with close tolerance to reduce thermal resistance.

Tflex B200 is tacky on both sides and requires no additional adhesive coating to inhibit thermal performance. The tack is designed to hold the pad in place during assembly and transport.

Other options available within the Tflex B200 series are the Tflex B200MFG and Tflex B200FG. The Tflex B200MFG features fiberglass in the middle, high tensile strength, and tack characteristics on both sides. The Tflex B200FG has fiberglass enforcement protection located closer to one side of the material and has a higher deflection than the B200MFG option.

Resource Materials

• Tflex™ B200 Application Note
• Tflex™ B200 Datasheet