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Epoxy Encapsulating and Potting Compound
Thermally conductive epoxy encapsulating and potting compound 832TC
100% solids. MG Chemicals formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission.
Features
- Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
- Two part epoxy, with a 1 to 1 mixing ratio by volume
- Two hour working time
- Suitable for large production runs
- Cures in 2 days at room temperature or one hour at 65°C
Published: 2009-02-25
Portugal